As the world progresses towards the era of 6G, scientists and engineers are faced with the challenge of optimizing wireless communications at extremely high frequencies. The transition from 5G to 6G brings with it a multitude of issues such as signal attenuation and interference, making it imperative to find innovative solutions to maintain signal integrity. Traditional insulating materials like glass and ceramics have been the go-to choice, but their high cost and complexity in fabrication pose limitations for mass-produced devices required for high-end 6G technologies.
In a quest to address these challenges, a research team from the Tokyo Institute of Technology has turned towards polymeric materials, specifically polyimides (PIs), as potential alternatives for high-frequency dielectric applications. Led by Professor Shinji Ando, the team’s latest study published in Applied Physics Letters on June 6, 2024, sheds light on the promising properties of PIs for next-generation telecommunications. PIs have garnered attention due to their thermal stability, mechanical toughness, flexibility, lightweight, and favorable dielectric properties.
The research team delved into the molecular structures of 11 different PIs to analyze their dielectric properties. By utilizing a Fabry–Pérot resonator, the researchers were able to measure the dielectric constant (Dk) and the dissipation factor (Df) of the PIs in the 110–330 GHz range. These parameters are crucial for assessing a material’s ability to minimize signal loss and maintain signal integrity at high frequencies. The results showed that PIs with higher fluorine content exhibited lower Dk values, with perfluorinated polyimides demonstrating significantly lower Dk and smaller Df compared to other PIs.
The findings of this study offer valuable insights into the dielectric qualities of PIs, paving the way for the development of advanced polymer-based insulating materials for 6G technologies. With the potential to tap into the terahertz range, engineers can leverage these discoveries to enhance the speed and reliability of telecommunications systems. Further research, including spectroscopic studies in the THz range, will be crucial in identifying the most suitable types of PIs for high-frequency applications. Professor Ando emphasizes the importance of ongoing efforts in this field to drive the innovation of high-performance insulating materials for the future of telecommunications.
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